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| 1 2010.6 w w microsd card connectors dm3 series new features common to the entire series 1. extremely small size small external dimensions and the above-the-board height make the connectors the smallest on the market. 2. reverse card insertion protection unique card slot design (patented) protects the connector from damage when the card is attempted to be inserted in reverse, allowing it to re-inserted correctly. 3. effective ground and shield configuration 4-connection points of the metal cover to the printed circuit board assures secure connection of the ground circuit and provides emi protection. 4. rigid and strong construction despite its small size, high-strengths materials used in the connectors produced a strong and rigid structure. 5. card detection switch the card detection switch is normally open dm3at and dm3bt (push - push, with ejection mechanism) card fall-out prevention built-in card tray and the unique push insertion-push ejection mechanism (patented) prevent accidental card ejection or fall- out. despite its small size the connectors will eject the card to a distance of 4.0 mm, allowing easy hold and removal of the card. exposed termination leads easy inspection and rework of the solder termination joints. dm3cs (hinge, push-pull, manual, without ejection mechanism) simple and reliable card insertion hinged metal cover provides location and guides the card during the insertion / removal. closing of the cover confirms the electrical and mechanical connection with a tactile click sensation. reliable contact with the card contact pads unique contact design and card slide action will clean the contact areas of the card. accessible termination areas contact solder terminations may be inspected and reworked. dm3d (push -pull, manual, without ejection mechanism) partial card insertion hold card will not fall-out even when it is not fully inserted. full insertion and electrical / mechanical connection is confirmed with a distinct tactile feel. accessible termination areas an inner lead system that can be reworked is used in this design. contact solder terminations may be inspected and reworked. card insertion-ejection push-push hinge-manual insertion/ ejection push-pull manual insertion/ ejection dm3at dm3bt dm3cs dm3d 2~4 5~6 7~8 9~10 series image page t h e p r o d u c t i n f o r m a t i o n i n t h i s c a t a l o g i s f o r r e f e r e n c e o n l y . p l e a s e r e q u e s t t h e e n g i n e e r i n g d r a w i n g f o r t h e m o s t c u r r e n t a n d a c c u r a t e d e s i g n i n f o r m a t i o n .
dm3 series microsd card connectors 2 dm3 at ? sf ?pejm5 specifications(dm3 series) ratings current rating: 0.5a voltage rating: 125v ac operating temperature range: -25? to +85? (note 1) storage temperature range : -40? to +85? (note 2) operating humidity range: rh 95% max. (no condensation) ordering information 1 4 2 3 measure at 500 v dc 500 v ac / 1 minute 1ma frequency: 10 to 55 hz, single amplitude of 0.75 mm, 3 directions for 2 hours 96 hours at of 40 2?, and humidity of 90 to 95% -55? ? 5 to 35? ? 85? ? 5 to 35? times: 30 min. ? 5 min. ? 30 min. ? 5 min. 5 cycles 10,000 cycles, 400 to 600 cycles per hour (dm3at, dm3b) 5,000 cycles, 400 to 600 cycles per hour (dm3c, dm3d) reflow : at the recommended temperature profile manual soldering : 350? for 3 seconds 1000 m? min. (initial value) no flashover or insulation breakdown 100m? max. (initial value) no electrical discontinuity of 100 ns or longer no damage, cracks or parts dislocation. contact resistance: 40 m? max. (change from initial value) insulation resistance: 100 m? min. no damage, cracks or parts dislocation. contact resistance: 40 m? max. (change from initial value) insulation resistance: 100 m? min. no damage, cracks or parts dislocation. contact resistance: 40 m? max. (change from initial value) no deformation of components affecting performance. 1. insulation resistance 2. withstanding voltage 3. contact resistance 4. vibration 5. humidity 6. temperature cycle 7. durability 8. resistance to soldering heat item specification conditions note 1: includes temperature rise caused by current flow. note 2. the term "storage" refers to products stored for long period prior to mounting and use. series name: dm3 connector type : at push-push (ejection mechanism), top board mounting (standard) bt push-push (ejection mechanism), bottom board mounting (reverse) cs hinge, push-pull (no ejection mechanism), top board mounting (standard) d push-pull (no ejection mechanism), top board mounting (standard) number of contacts : 8 termination type : sf right-angle smt(standard) dsf right-angle smt(reverse) card ejection code : pejm5, pejs (push insert/push eject) none : manual card insertion/ejection 1 4 2 3 materials and finishes remarks ul94v-0 ------------------- ------------------- ------------------- part material finish insulator contacts guide cover other components lcp copper alloy stainless steel copper alloy stainless steel piano wire (dm3at) (dm3bt) (dm3at, dm3bt) (dm3bt) color: black contact area: gold plated lead area: gold plated lead area: gold plated ------------------- nickel plated dm3at, dm3bt remarks ul94v-0 ------------------- ------------------- part material finish insulator contacts guide cover lcp copper alloy stainless steel color: black contact area: gold plated lead area: gold plated tin plated dm3cs, dm3d t h e p r o d u c t i n f o r m a t i o n i n t h i s c a t a l o g i s f o r r e f e r e n c e o n l y . p l e a s e r e q u e s t t h e e n g i n e e r i n g d r a w i n g f o r t h e m o s t c u r r e n t a n d a c c u r a t e d e s i g n i n f o r m a t i o n . 3 dm3 series microsd card connectors example of applications dm3at-sf-pejm5 portable device recommended pcb mounting pattern 8.65 1.3 15.1 c0.15 14.1max 2.7 0.8 2.8 1 1.9 (3.2) 3.25 9.1 9.25max 10min 7.7 1.55 p=1.1 0.7 1 1.2 14.5 0.15min 1.2 3.7 9.9 14.05 7.9min 0.7 13.3min 0.5 8.2min 4.4max 6min 0.15 5.7max 8.9min y ! ! 1 3 3 3 c l indicates the center line of the microsd card slot. no conductive traces. card inserted card detection switch without the card open closed (a) (b) (a) (b) 1 3 2 note all dimensions: mm dm3at push-push (ejection mechanism), top board mounting (standard) part number cl no. dm3at-sf-pejm5 609-0031-0 card detection switch(b) #5(clk) #4(vdd) #3(cmd) #2(cd/dat3) #1(dat2) card detection switch(a) microsd card 2.9?0.15 (3.2) (7.35) (15) (0.8) (16.75):card over stroke position (17.55):card lock position (21.55):card eject position 15.95 13.85 (11) (5.5) 15.95 l c 1.68 #8(dat1) #7(dat0) #6(vss) 2 2 1 all dimensions: mm t h e p r o d u c t i n f o r m a t i o n i n t h i s c a t a l o g i s f o r r e f e r e n c e o n l y . p l e a s e r e q u e s t t h e e n g i n e e r i n g d r a w i n g f o r t h e m o s t c u r r e n t a n d a c c u r a t e d e s i g n i n f o r m a t i o n . dm3 series microsd card connectors 4 packaging specifications (16.35) 14.2 20 ?1.5 1.75 2 p=4 unreeling direction 28.4 32 (3.2) embossed carrier tape dimensions (1,500 pieces per reel) reel dimensions 32.4 ?380 ?80 start portion equipped with components embossed carrier tape oval circle top cover tape empty(160mm min) empty(100mm min) end leader(400mm min) trailer all dimensions: mm t h e p r o d u c t i n f o r m a t i o n i n t h i s c a t a l o g i s f o r r e f e r e n c e o n l y . p l e a s e r e q u e s t t h e e n g i n e e r i n g d r a w i n g f o r t h e m o s t c u r r e n t a n d a c c u r a t e d e s i g n i n f o r m a t i o n . 5 dm3 series microsd card connectors example of applications dm3bt, push-push (ejection mechanism), bottom board mounting (reverse) part number cl no. dm3bt-dsf-pejs 609-0029-9 c l (5.5) (11) microsd card #8(dat1) #7(dat0) #6(vss) #5(clk) #4(vdd) #3(cmd) #2(cd/dat3) #1(dat2) 15.95 (21.55) card eject position (17.55) card lock position (16.75) card over stroke position (15) (0.55) 16.05 card detection switch(a) card detection switch(b) 13.85 15.45 2.90.15 2.7max 6.7max 2.38max (3.2) 1.83 15.1 (6.5) 1 3 3 3 2 2 recommended pcb mounting pattern 13.3 9.7 0.7 1.2 0.7 p=1.1 7.7 10min 9.25max 8.9 3.05 1.9 1.2 3.2 0.8 14.75 0.2 1.4 14.3 3.5 7.7min 0.35min 1?0.05 1.9 1.5 8.65 0.5 0.15 (3.2) ! 1 4 c l indicates the center line of the microsd card slot. oblique-hatched area is projection of contact. card inserted card detection switch without the card open closed (a) (b) (a) (b) 1 3 2 no conductive traces. 4 note all dimensions: mm all dimensions: mm dm3bt-dsf-pejs portable device t h e p r o d u c t i n f o r m a t i o n i n t h i s c a t a l o g i s f o r r e f e r e n c e o n l y . p l e a s e r e q u e s t t h e e n g i n e e r i n g d r a w i n g f o r t h e m o s t c u r r e n t a n d a c c u r a t e d e s i g n i n f o r m a t i o n . dm3 series microsd card connectors 6 32.4 circle trailer oval start ?80 ?380 empty(160mm min) embossed carrier tape portion equipped with components leader(400mm min) end empty(100mm min) top cover tape packaging specifications (3.75) unreeling direction 32 28.4 p14 2 1.75 ?1.5 20 14.2 (16.35) embossed carrier tape dimensions (1,200pieces per reel) reel dimensions all dimensions: mm t h e p r o d u c t i n f o r m a t i o n i n t h i s c a t a l o g i s f o r r e f e r e n c e o n l y . p l e a s e r e q u e s t t h e e n g i n e e r i n g d r a w i n g f o r t h e m o s t c u r r e n t a n d a c c u r a t e d e s i g n i n f o r m a t i o n . 7 dm3 series microsd card connectors recommended pcb mounting pattern 5.4min 7.8max 7.8max 0.55min 8.25min 2.9max (13.8) (14.1) 12.4 4.1min 3.5max 10.1min 9.5max 7.7 p11.1 0.7 1.4 1.2 1.5 9.3 2.8 2.6 12.9 2.6 12.9 14.4 1.2 2.7 2.7 1.65 6.3 1.4 (3.2) ! 1 3 3 3 gnd(1) gnd(2) gnd(3) gnd(4) gnd(1) gnd(2) gnd(3) gnd(4) closed open c l indicates the center line of the microsd card slot. no conductive traces. card inserted card detection switch without the card 1 3 2 note example of use applications dm3cs, hinge, push -pull (no ejection mechanism), top board mounting (standard) part number cl no. dm3cs-sf 609-0032-3 12 0.1 13.9 (15.45):lock position 14.1 13.8 (6.9) (11) (0.93) (1.78) (5.5) (0.2) 1.83 ! card detection switch microsd card 8(dat1) 7(dat0) 6(vss) 5(clk) 4(vdd) 3(cmd) 2(cd/dat3) 1(dat2) 1 2 all dimensions: mm all dimensions: mm dm3cs-sf (shown open for card insertion) dm3cs-sf (shown closed, with card inserted) portable device t h e p r o d u c t i n f o r m a t i o n i n t h i s c a t a l o g i s f o r r e f e r e n c e o n l y . p l e a s e r e q u e s t t h e e n g i n e e r i n g d r a w i n g f o r t h e m o s t c u r r e n t a n d a c c u r a t e d e s i g n i n f o r m a t i o n . 8 dm3 series microsd card connectors ?80 ?380 32.4 start circle oval empty(160mm min) empty(100mm min) top cover tape end embossed carrier tape portion equipped with components leader(400mm min) trailer packaging specifications (3.4) 14.2 20 ?1.5 1.75 2 p14 28.4 32 unreeling direction embossed carrier tape dimensions (1,300pieces per reel) reel dimensions all dimensions: mm t h e p r o d u c t i n f o r m a t i o n i n t h i s c a t a l o g i s f o r r e f e r e n c e o n l y . p l e a s e r e q u e s t t h e e n g i n e e r i n g d r a w i n g f o r t h e m o s t c u r r e n t a n d a c c u r a t e d e s i g n i n f o r m a t i o n . 9 dm3 series microsd card connectors example of applications recommended pcb mounting pattern 1.5 1.75 1.5 1.1 7.7 7.5 9.15 10.7 6.85 1.5 8.35 1 0.55 9.4 10.9 0.8 0.8 8.1min 1 1.85 0.4min 2.55 max ( 4.5 ) 5.05 min 4max 6min 8.2max 10.2 min 1.4 3 c l 1 c l indicates the center line of the microsd card slot. no conductive traces. card inserted card detection switch without the card open closed (a) (b) (a) (b) 1 3 2 note dm3d, push-pull (no ejection mechanism), top board mounting (standard) part number cl no. dm3d-sf 609-0025-8 microsd card card center 1(dat2) 2(cd/dat3) 3(cmd) 4(vdd) 5(clk) 6(vss) 7(dat0) 8(dat1) card detection switch (b) card detection switch (a) (15.8):card fully inserted 1 0.9 (4.5) (6) (11) 2.7 1.55 11.45 11.45 11.95 3.35 (5.5) (15) (0.7) 9.65 2 2 all dimensions: mm all dimensions: mm dm3d-sf portable device t h e p r o d u c t i n f o r m a t i o n i n t h i s c a t a l o g i s f o r r e f e r e n c e o n l y . p l e a s e r e q u e s t t h e e n g i n e e r i n g d r a w i n g f o r t h e m o s t c u r r e n t a n d a c c u r a t e d e s i g n i n f o r m a t i o n . dm3 series microsd card connectors 10 lead section (400mm min.) mounting section end section top cover tape blank section (100mm min.) embossed carrier tape blank section (160mm min.) 24.4 ?380 ?80 unreeling direction packaging specifications unreeling direction 2 24 22.25 11.5 1.75 ?1.5 16 ( 11.85 ) p= 4 embossed carrier tape dimensions (2,000pieces per reel) reel dimensions all dimensions: mm t h e p r o d u c t i n f o r m a t i o n i n t h i s c a t a l o g i s f o r r e f e r e n c e o n l y . p l e a s e r e q u e s t t h e e n g i n e e r i n g d r a w i n g f o r t h e m o s t c u r r e n t a n d a c c u r a t e d e s i g n i n f o r m a t i o n . 11 dm3 series microsd card connectors refer to applicable operation manual listed below for additional precautions. series dm3at series dm3bt series dm3cs series dm3d series etad-f0345 ETAD-F0324 etad-f0335 etad-f0353 operation manual number recommended temperature profile precautions 1. do not immerse or clean the entire connector with cleaning solutions as this may affect proper operation of the ejection mechanism and electrical performance of the connector 2. do not apply excessive force to the connector when handling or after installation on the pc board. 3. the connectors will reliably connect and operate with the correctly inserted microsd tm cards. follow the correct insertion / ejection procedure for the specific connector in use. attempts of incorrect insertion of the card may cause damage to the connector or the card. 4. the connector must be correctly mounted on the pc board before the card can be inserted. do not insert the card in the un-mounted connector. 5. mounting on the flexible printed circuit (fpc) to assure correct performance it is recommended that a flat reinforcement plate 0.3 mm min. thick be used under the fpc. 6. small visible residual manufacturing fluids or tooling marks do not affect connector's performance. 7. repeated insertions and removal of the cards may leave some marks on the card itself. this will have no affect on the connector performance. hrs test condition solder method :reflow, ir/hot air environment :room air solder composition :paste, 96.5%sn/3.0%ag/0.5%cu (senju metal industry, co., ltd.'s part number:m705-grn360-k2-v) test board :glass epoxy 60mm100mm1.0mm thick metal mask :0.12mm thick number of reflow cycles : 2cycles max. the temperature profiles shown are based on the above conditions. in individual applications the actual temperature may vary, depending on solder paste type, volume / thickness and board size / thickness. consult your solder paste and equipment manufacturer for specific recommendations. temperature 50 90 to 120 seconds preheating 50 seconds soldering time (seconds) (?) 100 150 200 250 150? 200? 230? min. peak:250? max t h e p r o d u c t i n f o r m a t i o n i n t h i s c a t a l o g i s f o r r e f e r e n c e o n l y . p l e a s e r e q u e s t t h e e n g i n e e r i n g d r a w i n g f o r t h e m o s t c u r r e n t a n d a c c u r a t e d e s i g n i n f o r m a t i o n . |
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